Silicone Encapsulants and potting compounds for Printed Circuit Board

Electronic Potting Silicone Rubber can be vulcanized under room/high temperature, low viscosity, easy mixing and pouring.

Silicone Encapsulants and potting compounds for Printed Circuit Board Applications & Features:

It can be vulcanized under room temperature or high temperature with low viscosity, easy mixing and pouring, and it is applicable to bulk pouring with excellent electrical performance. It is applicable to sealing, bonding, coating for electronic parts.

                                         

Silicone Encapsulants and potting compounds for Printed Circuit Board Applications & Features:

It serves sticky viscosity, low shrinkage and non-corrosiveness. It can be used for a long time under the temperature of -60~200C with the characteristics of moisture-proof and waterproof, radiation-proof, as well as weatherable and anti-ageing. It is applicable to sealing, bonding and coating for electronic parts.

 

Silicone Encapsulants and potting compounds for Printed Circuit Board Parameters:

Model	9055#		9301#
Grade	General Purpose		Gelatin
Components	A	B	A	B
Color	Grey	White	Black	Transparent
Mixing Ratio	1	1	1	1
Viscosity Pa.s	2.5+/-0.5	2.5+/-0.5	2.5+/-0.5	2.5+/-0.5
Pot Life(Min/25°C)	60-90		300
Curing Time(Min)	25°C/180 or 80°C/20		80°C/30
Hardness(Shore A)	55+/-5		0
Dielectric Strength (kv/mm)	≥25		≥25
Elongation Break(%)	-		-
Volume Resistance(Ω)	≥1.0X1015		≥1.0X1015
Dielectric Constant(1.2mhz)	3.0-3.3		3
Voltage Resistance(KV.MM-1)	-		-
Temperature Resistance(°C)	-60 ~200		-60 ~200
Flame Retardant	UL94-V1		UL94-V1

 

Any questions of Silicone Encapsulants and potting compounds for Printed Circuit Board, please feel free to contact Aaron: 

TEL: 086-755-89948006

FAX: 086-755-89948030

MOBILE:086-13622300503 

Silicone Encapsulants and potting compounds for Printed Circuit Board